Building Supply Chain Resilience: Selecting Reliable Capacitor Suppliers

Supply chain stability is becoming a key consideration for companies when selecting electronic components. Discover more!

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Sony-TSMC $4.7B Deal Helps Thwart Samsung, Analysts Say

Sony and TSMC have joined forces to counter Samsung's growing presence in smartphone image sensors, particularly for Apple.

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Agentic AI, Multi‑Physics, and Standards Will Redefine Chips Design

Agentic AI, brutal physics bottlenecks, and standards are remaking chip design from silicon to systems.

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AMD Challenges GPU-centric Architectures as It Takes Aim at Nvidia in Robotics

AMD’s new SoC for robots combines CPU, GPU, NPU on one chip with unified memory.

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Managing Your Component Library for Supply Chain Resilience

To take a PCB from design to production, an unmanaged component library is a hidden liability. Obsolete parts, single-source vulnerabilities, long lead times, counterfeit exposure, and compliance gaps often go undetected until they trigger costly redesigns, audit failures, or production delays. This guide shows how to solve those problems at their source. By transitioning to a database-driven library with governed workflows, professionals can surface and mitigate supply chain risk at the point of part selection, before design decisions become expensive commitments. Readers will learn how to implement lifecycle tracking, multi-sourcing strategies, and compliance data management across RoHS, REACH, and PFAS requirements.

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AI Hardware’s Next Frontier Is Integration

The LID World Summit 2026 showed why AI progress now depends on system-level advances in memory, packaging, photonics, and power.

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Why AI Adoption in Materials R&D Depends More on People Than Technology

The technology works. The organization has to catch up.

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U.S. Startup Fields Quantum Sensors to Reduce Reliance on GPS

GPS spoofing is a sitting duck; Dirac’s quantum sensors aim to navigate air, sea, and tunnels without satellites.

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Leading-edge AI IC designs demand comprehensive HAV methodologies  

Learn how comprehensive hardware-assisted verification helps AI SoC teams accelerate RTL, software development and system validation. 

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Can AI Command Earth-to-Orbit Operations?

The aerospace and defense sector is facing a confluence of geopolitical instability, rapid technological advances, evolving security requirements, and complex global supply chains.

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After Seven CEOs in 10 Years, Imagination Is Sticking to Its Strategy

Imagination dumps CPU/NPU dreams, doubles down on GPUs and China under CEO No. 7.

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ROLEC’s technoPLUS: IP-rated Pole-mount Plastic Enclosures for IoT/IIoT and Factory Automation

IoT/IIoT and factory automation are driving demand for ROLEC’s updated pole-mountable technoPLUS (IP 66, IP 67, IP 69K) plastic enclosures. Electronics designers specify them for ‘close-to-the-process’ devices that must survive dust, moisture and regular washdowns. Compact technoPLUS provides robust protection – allowing industrial electronics to be mounted directly on machine frames, production-line supports, conveyor structures or masts at the heart of the process. These tough, UV-stable enclosures are ideal for IIoT LoRaWAN, NB-IoT and MQTT edge gateways, cellular telemetry units, industrial data loggers, edge computing nodes, remote PLC communications and wireless sensor concentrators.

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BIWIN and Tera Indústria de Semicondutores Sign Strategic Partnership Agreement

Shenzhen, China / Manaus, Brazil – August 6th, 2026: BIWIN Semiconductor (HK) Company Limited ("BIWIN"), a global provider of memory and storage packaging solutions, and TERA INDÚSTRIA DE SEMICONDUTORES S.A. ("Tera"), a Brazil-based semiconductor memory packaging company, announce the signing of a strategic partnership framework agreement to manufacture and distribute memory and storage solutions in Brazil. The partnership establishes a comprehensive collaboration encompassing equipment consignment, technical exchange, and industrial cooperation. Brazil represents one of the most strategically significant markets for the global semiconductor industry, underpinned by strong government industrial incentives, a large domestic consumption base, and mandatory local manufacturing requirements.

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Chiplet Architectures as a Practical Path to Scalable Automotive Compute

Chiplets are auto’s escape hatch from bloated SoCs, scaling SDV compute without wrecking cost or software.

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Inside Device Connectivity: A New Design Discipline for Next-Gen Vehicles

Join this webinar where our expert will introduce Inside Device Connectivity as a focused design discipline to ensure power, signal, and data move predictably and robustly within automotive electronics.

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STMicroelectronics Bets on Hardware-Based Post-Quantum Cryptography with ST54M

ST’s ST54M bakes post-quantum crypto into phone hardware before hackers harvest today’s secrets.

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AI Chip Startup Taalas Acquired By AMD

AMD plans to use Taalas chips alongside its GPUs for AI inference, likely as an LLM decode accelerator.

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GlobalFoundries’ Growth Makes the Case for a U.S. Photonics Buildout

GlobalFoundries’ data-center surge turns U.S. photonics from subsidy pitch to AI bottleneck bet.

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U.S. Manufacturing Activity Hits Four-Year High in July

In July, U.S. manufacturing activity remained in expansion territory, growing at its fastest pace in more than four years.

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Beyond the Fab: Building Europe’s Next Generation of Semiconductor Champions

Europe's next semiconductor champions will emerge from design expertise, customer knowledge, and IP—not manufacturing capacity alone.

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Samsung Lays Out AI Memory Roadmap

Samsung bets on zHBM and zNAND-O to smash AI’s memory wall, promising 8× HBM5 performance and 3D stacks.

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Unstacking the Future: Navigating the 3D IC Frontier

3D IC introduces new system-level hurdles that demand innovative 3D IC solutions that address exploration, design, analysis, reliability, and test. 

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Safeguarding Fab Throughput with AI-Augmented Data Insights

Discover how a Al-infused visual analytics platform empower engineers to solve complex manufacturing challenges for faster root cause analysis.

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Neuromorphic Insect Eye for Physical AI

Neuromorphic engineering, modeled on biological nervous systems can solve latency and power problems of conventional cameras.

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electronica 2026: Electronics as the Basis of the All-Electric Society

electronica 2026 puts chips, AI, energy efficiency, and cyber resilience at the heart of the all-electric society.

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Automotive Cybersecurity: AI Attack Surfaces Grow

AI and software-defined cars turn APIs, servers, and chargers into hacker playgrounds; see why automakers must harden fleets now.

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Jamie Urquhart (1957-2026): Friendly, Supportive, Right to the End

Arm co-founder Jamie Urquhart backed chips, startups and people to the end—read how his quiet force shaped an industry.

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New Space: Power, Computing and Thermal Challenges Beyond Earth

New Space explores the technologies reshaping the commercial space economy, from CubeSat power architectures, AI-enabled onboard computing, and advanced semiconductor platforms to high-altitude pseudosatellites (HAPS), space-based data centers, and next-generation thermal management.

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Protecting Military AI Agents From Cyberthreats

Military AI faces hackers, poisoned data, and weak rules; lock it down with zero trust, red-teaming, and real governance.

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Renesas Tackles Memory Bottleneck with MRDIMM Update

Renesas’ Gen 3 DDR5 MRDIMM attacks AI’s memory choke point with 16,000 MT/s bandwidth and no platform overhaul.

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